The ThermalFusion syringe contains 4g of the interface material. As with most thermal paste manufacturers, the syringe is not full of the paste, but typically only the very end has any in it. Some brands do offer a larger 15g or more package, which usually is the same size tube, just with more of the paste inside. The applicator is thin and very flexible. Cooler Master lists the specifications as having a specific gravity of 3.5, thermal conductivity of 2.89, and thermal resistance of 0.032.
I will be trying out the ThermalFusion 400 on one of my older chips, an AMD 6400+ X2 Windsor core. The large 90nm die and high voltage requirements generate lots of heat which should make for an interesting test bed. The cap is unscrewed from the syringe and a light press on the plunger pushes a generous portion of the paste from the tube. As is often the case, it is difficult to regulate the amount of paste dispersed as the plunger takes more force to overcome the initial resistance than it does once it is moving. The paste is thick, similar in consistency to toothpaste, and seems to stick adequately, although not overmuch, to the surface of the heat spreader.
Usually I just use the end of the dispenser to dab small amounts of thermal paste randomly around the surface of the chip, however since Cooler Master thoughtfully included this applicator I opted to use it instead. The ThermalFusion 400 was somewhat difficult to spread due to its consistency. It did not want to go on very thin, such as you would achieve with a paste like AS5. Also the applicator tended to bend under pressure and so it was difficult to get an even coating across the surface of the die. Overall I found it easier simply to revert to the dab method. Once you have covered the surface of the processor and installed the heatsink it is always a good idea to pull it back off and check the pattern on the underside of the base to ensure complete coverage area.
Now let's try the ThermalFusion out and see how it performs.