CES 2012: Gigabyte 01-31-2012 |
Gigabyte has quite a good reputation among PC hardware and gaming enthusiasts. I had the pleasure of seeing some of their solutions in their demo suite at the Venetian. Gigabyte displayed a plethora of graphics cards and motherboards, including a few motherboard engineering samples for Intel's next-generation platform due out in a few months. Samples spanned all budgets, including the GA-B75M-D3H, GA-Z77X-UD3H, GA-Z77X-UD5H, G1.Sniper 3, and G1.Sniper M3.
CES 2012: MSI 01-29-2012 |
MSI is jumping on the Intel Thunderbolt bandwagon with a new product called GUS II. GUS II is an external graphics card enclosure designed to house a single card with a power draw no higher than 150 watts, ideally targeted at notebook gamers. The device operates over the Thunderbolt interface on one end with a PCIe X16 slot for cards inside the enclosure.
CES 2012: Thermaltake 01-26-2012 |
We stopped by Thermaltake to visit with them at their suite in the Palazzo hotel. Here Thermaltake showed us their new Level 10 GTS mid-tower chassis. The GTS features USB 3.0, EasySwap storage bays, an HDD storage system and a nice cable management system. The chassis is constructed from steel although there wasn’t a net weight listed. A 200mm LED fan comes pre-installed in the front for intake and there’s a 120mm rear exhaust fan.
CES 2012: OCZ Technology 01-23-2012 |
We stopped by OCZ's suite at Aria to check out what they had on tap for 2012. The highlight of our time with OCZ was their next-generation Everest 2 NAND flash controller platform. Set for release next June, the SATA 6Gb/s interface boasts preliminary numbers of 550MB/s read and 500MB/s write with up to 90,000 4K random write IOPS. These IOPS are a good bit higher than SandForce 2000 series controllers are capable of.
CES 2012: Cooler Master 01-21-2012 |
We visited with Cooler Master at the Bellagio after they hosted one heck of a party the night before. Cooler Master is celebrating their 20 year anniversary with a plethora of new products for 2012. The PR team first showed us their upcoming heatsink known as the TPC-812 which utilizes a new technology called Vertical Vapor Chamber. We were told that Cooler Master is one of only two companies in the world that are capable of producing this technology.